Micron Tech. v. Godo Kaisha IP Bridge 1

Decision Date06 December 2021
Docket NumberIPR2020-01008,Patent 6,445,047 B1
PartiesMICRON TECHNOLOGY, INC., Petitioner, v. GODO KAISHA IP BRIDGE 1, Patent Owner. Claims 35 U.S.C. § References/ Basis Claims Shown Unpatentable Claims Not Shown Unpatentable
CourtPatent Trial and Appeal Board

FOR PETITIONER: Jeremy Jason Lang K. Patrick Herman ORRICK HERRINGTON & SUTCLIFFE LLP

FOR PATENT OWNER: Gerald B. Hrycyszyn Marc S. Johannes Richard F Giunta Elisabeth Hunt Gregory S. Nieberg Robert A. Jensen WOLF GREENFIELD & SACKS, P.C.

Before JUSTIN T. ARBES, DAVID C. McKONE, and AMBER L. HAGY Administrative Patent Judges.

JUDGMENT FINAL WRITTEN DECISION DETERMINING ALL CHALLENGED CLAIMS UNPATENTABLE 35 U.S.C.§ 318(A)

ARBES Administrative Patent Judge.

I. INTRODUCTION
A. Background and Summary

Petitioner Micron Technology, Inc. ("Petitioner"), filed a Petition (Paper 7, "Pet.") requesting inter partes review of claims 1—4 of U.S. Patent No. 6, 445, 047 B1 (Ex. 1001, "the '047 patent") pursuant to 35 U.S.C. § 3 11(a). On December 7, 2020, we instituted an inter partes review as to all challenged claims on all grounds of unpatentability asserted in the Petition. Paper 10 ("Decision on Institution" or "Dec. on Inst."). Patent Owner Godo Kaisha IP Bridge 1 ("Patent Owner") subsequently filed a Patent Owner Response (Paper 15, "PO Resp."), Petitioner filed a Reply (Paper 18, "Reply"), and Patent Owner filed a Sur-Reply (Paper 22, "Sur-Reply"). An oral hearing was held on September 15, 2021, and a transcript of the hearing is included in the record (Paper 30, "Tr.").

We have jurisdiction under 35 U.S.C. § 6. This Final Written Decision is issued pursuant to 35 U.S.C. § 318(a). For the reasons that follow, we determine that Petitioner has shown by a preponderance of the evidence that claims 1—4 are unpatentable.

B. Related Matters

The parties indicate that the '047 patent is the subject of the following pending district court case: Godo Kaisha IP Bridge I v. Micron Technology, Inc., Case No. 20-cv-00178 (W.D. Tex.) ("the district court case"). See Pet. 5; Paper 5, 1. Petitioner also filed petitions challenging claims of other patents asserted in the district court case in Cases IPR2020-01007 and IPR2020-01009.

C. The '047Patent

The '047 patent discloses a semiconductor device including two different surface-channel-type metal-oxide-semiconductor field-effect transistors (MOSFETs) with different threshold voltages. Ex. 1001, col. 1, 11. 5-10. According to the '047 patent, "it is very important to form surface-channel-type MOSFETs of multiple types on a semiconductor chip" to enhance performance in a large-scale integration (LSI) system. Id. at col. 1, ll. 11-17. The '047 patent states that it was known to use, in the same semiconductor device, MOSFETs in a "logic circuit block" that "enhance their driving power by lowering the threshold voltage and increasing the saturated current value" and MOSFETs in a "memory cell block" that "increase a data retention time by raising the threshold voltage value and minimizing the leakage current." Id. at col. 1, ll. 18-27. Further, to form multiple types of surface-channel-type MOSFETs with different threshold voltages, it was known to "mak[e] the dopant concentrations in the channel regions different by implanting dopant ions at mutually different doses into the channel regions." Id. at col. 1, ll. 47-52. Setting a higher implant dose for the memory cell block MOSFET results in a higher threshold voltage. Id. at col. 1, ll. 52-57. Also, as gate insulating films become thinner due to the need for miniaturization, the dopant concentration needed to realize a certain threshold voltage increases. Id. at col. 1, ll. 58-62. The '047 patent discloses that "performance degrades ... as the dopant concentration in the channel region gets higher" due to, for example, increased "leakage current flowing through the pn junction." Id. at col. 1, 1. 63-col. 2, 1. 12.

The '047 patent seeks to solve these problems using a first-surface-channel-type MOSFET in a "logic circuit block" "with a threshold voltage of a relatively small absolute value" and a second-surface-channel-type MOSFET that "controls power to be supplied to the logic circuit block" "with a threshold voltage of a relatively large absolute value." Id. at col. 2, 11. 20-24, 58-62. To increase the threshold voltage "without raising the dopant concentration," the second-surface-channel-type MOSFET includes a gate electrode "formed out of a refractory metal film made of a refractory metal or a compound thereof (e.g., titanium nitride, tungsten, molybdenum, tantalum). Id. at col. 2, ll. 28—48, col. 3, ll. 61-63, col. 6, ll. 46-51. The second-surface-channel-type MOSFET also has a thicker gate insulating film to "enhance its OFF-state leakage current characteristics" and improve storage ability. Id. at col. 3, ll. 4-16.

Figures 4(a)-4(c) of the '047 patent are reproduced below.

(Image Omitted)

Figures 4(a)-4(c) depict the later steps of a fabrication process for a semiconductor device with "a first [n-type metal-oxide-semiconductor (NMOS)] transistor . . . formed in a peripheral circuit region on the left side, while second NMOS transistors are formed in a memory cell region on the right side." Id. at col. 6, ll. 60-67. The first-surface-channel-type NMOS transistor has first gate electrode 207A, which is "made of an n-type polysilicon film" and has "a threshold voltage with a relatively small absolute value," formed on first gate insulating film 206A "with a relatively small thickness of2.5 nm" Id. at col. 8, ll. 15-20, 26-30. The second-surface-channel-type NMOS transistors each have second gate electrode 218, which is made of a refractory metal (tungsten) and has "a threshold voltage with a relatively large absolute value," formed on second gate insulating film 206B "with a relatively large thickness of 5 nm." Id. at col. 8, ll. 20-25, 30-35. P-type doped region 205 in the channel region of the second-surface-channel-type NMOS transistors has a "relatively low dopant concentration" as compared to p-type doped region 203 of the channel region of the first-surface-channel-type NMOS transistor, which has a "relatively high dopant concentration." Id. at col. 7, ll. 6-22, col. 8, 11. 36-40.

D. Illustrative Claim

Challenged claim 1 of the '047 patent is independent. Claims 2-4 depend from claim 1. Claim 1 recites:

1. A semiconductor device comprising:
a first-surface-channel-type MOSFET with a first threshold voltage; and
a second-surface-channel-type MOSFET with a second threshold voltage having an absolute value greater than an absolute value of said first threshold voltage,
wherein the first-surface-channel-type MOSFET includes:
a first gate insulating film formed on a semiconductor substrate; and
a first gate electrode, which has been formed out of a poly-silicon film formed directly on the first gate insulating film, and wherein the second-surface-channel-type MOSFET includes:
a second gate insulating film formed on the semiconductor substrate; and
a second gate electrode, which has been formed out of a refractory metal film formed directly on the second gate insulating film, the refractory metal film being made of a refractory metal or a compound thereof.
E. Evidence

The pending grounds of unpatentability in the instant inter partes review are based on the following prior art:

U.S. Patent No. 6, 424, 016 B1, filed May 23, 1997, issued July 23, 2002 (Ex. 1006, "Houston");
U.S. Patent No. 6, 165, 849, filed Dec. 4, 1998, issued Dec. 26, 2000 (Ex. 1007, "An"); and
Fumihiko Yanagawa et ah, A 1-µm Mo-Poly 64-kbitMOS RAM, IEEE Transactions on Electron Devices, vol. ED-27, NO. 8 (Aug. 1980) (Ex. 1004, "Yanagawa").[1]

Petitioner filed a declaration from John C. Bravman, Ph.D. (Ex. 1003) with its Petition and a reply declaration from Dr. Bravman (Ex. 1042) with its Reply. Patent Owner filed a declaration from Kelin Kuhn, Ph.D. (Ex. 2004) with its Response. Also submitted as evidence are transcripts of the depositions of Dr. Bravman (Exs. 2043, 2048) and Dr. Kuhn (Ex. 1041).

F. Asserted Grounds

The instant inter partes review involves the following grounds of unpatentability:

                              Claim(s) Challenged
                            
                              35 U.S.C. §
                            
                              Reference(s)/Basis
                            
                

1, 2, 4

102(b)[2]

Yanagawa

1, 2, 4

103(a)

Yanagawa [3]

103(a)

Yanagawa, An[4]

1, 2, 4

103(a)

Houston

103(a)

Houston, An
II. ANALYSIS
A. Level of Ordinary Skill in the Art

In determining the level of ordinary skill in the art for a challenged patent, we look to "1) the types of problems encountered in the art; 2) the prior art solutions to those problems; 3) the rapidity with which innovations are made; 4) the sophistication of the technology; and 5) the educational level of active workers in the field." Ruiz v. A.B. Chance Co., 234 F.3d 654, 666-667 (Fed. Cir. 2000). "Not all such factors may be present in every case, and one or more ofthem may predominate." Id.

Petitioner states that it treats the '047 patent as having an effective filing date of October 26, 1999, and argues that a person of ordinary skill in the art at that time would have had "a degree in electrical engineering, by a person having ordinary skill in the art.'" (citing KSR Int V Co. v. Tele/lex Inc., 550 U.S 398, 401 (2007))). physics, materials science, or a similar discipline, along with [two] years of experience in the development, design, or implementation of semiconductor devices," and would have been "aware of and generally knowledgeable about the structure and operation of [dynamic random-access memory (DRAM)]." Pet. 9, 29 (citing Ex. 1003 ¶¶ 34-37). Patent Owner does not address the level of ordinary skill in the art in its Response or Sur-Reply. Based on the full record developed during trial, including...

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