Semicaps Pte Ltd. v. Hamamatsu Corp.
Decision Date | 06 November 2019 |
Docket Number | Case No. 17-cv-03440-DMR |
Citation | 393 F.Supp.3d 802 |
Parties | SEMICAPS PTE LTD., Plaintiff, v. HAMAMATSU CORPORATION, et al., Defendants. |
Court | U.S. District Court — Northern District of California |
Hector J. Ribera, Ryan J. Marton, Carolyn Chang, David Douglas Schumann, Marton Ribera Schumann & Chang LLP, San Francisco, CA, for Plaintiff.
Adam Johnson Thurston, Drinker Biddle & Reath LLP, Ryan Seth Goldstein, Quinn Emanuel Urquhart Oliver and Hedges LLP, Los Angeles, CA, David Eiseman, IV, Quinn Emanuel Urquhart & Sullivan, San Francisco, CA, Jared Weston Newton, Pro Hac Vice, Kaiyeu Kevin Chu, Quinn Emanuel Urquhart Sullivan, Koichiro Minamino, Pro Hac Vice, Minamino Law Office PLLC, William Stephen Foster, Jr., Drinker Biddle and Reath LLP, Washington, DC, for Defendants.
Donna M. Ryu, United States Magistrate Judge Plaintiff SEMICAPS Pte Ltd. ("SEMICAPS") filed this patent case against Defendants Hamamatsu Corporation, Hamamatsu Photonics K.K., and Photonics Management Corp. (collectively, Defendants or "Hamamatsu"), alleging that Hamamatsu infringes the claims of U.S. Patent No. 7,623,982 (the " '982 patent"), which relates to testing of electronic circuits using a laser. Hamamatsu moves to dismiss the complaint, arguing that the asserted claims are invalid because they claim patent-ineligible subject matter. [Docket No. 49.] The court held a hearing on July 11, 2019. For the following reasons, the motion is denied.1
SEMICAPS is the owner by assignment of the 982 Patent 1:6-8, in order to "determine the location of defects on the semiconductor circuit." Opp'n 3.
SEMICAPS describes the relevant technology as follows: newly-fabricated integrated semiconductor circuits are "typically tested by connecting them to electronic test equipment that applies test signals to each integrated circuit and receives output signals from the circuit as a result." Id. While this method of testing can reveal defects, it does not identify the location of the defect in the integrated circuit. In order to determine the location of the defect, fabricators use "failure analysis systems ... to perform fault localization testing," which can be done using lasers in scanning microscopes. Id. at 3-4.
The 982 Patent at 1:16-19. These techniques include Optical Beam Induced Resistance Change ("OBIRCH"), Thermal Induced Voltage Alteration ("TIVA"), and Differential Resistance Measurement ("DReM"). Id. at 1:22-27. However, advances in integrated circuit technology, including "the use of more metallization layers and new low k inter-layer dielectric materials with lower thermal conductivity," have reduced the laser coupling efficiency, which in turn reduces the detection sensitivity. Id. at 1:28-33. The inventors explain that "conventional approaches" to improve the detection sensitivity of laser induced techniques have not been entirely successful. For example, increasing the power of the laser beam used "in order to compensate for the reduced laser coupling efficiency ... may not be desirable," because "there may be potential laser induced damage on the integrated circuit under test when the power of the laser beam used is too high." Id. at 1:38-49. Another approach is to use "a pulsed laser in conjunction with a lock-in amplifier," which increases detection sensitivity. Id. at 1:50-52. However, lock-in amplifiers are "not used in a real-time integrated circuit testing environment" because "accurate calibration and fine control of the lock-in amplifier parameters is typically difficult to achieve in practice." Id. at 1:62-67.
The 982 Patent, Abstract. A signal processor "process[es] the sample measurements of the response signal of the electronic circuit under test" by "accumulat[ing] the plurality of samples to generate a value, and then generat[ing] a test result based on the value generated." '982 Patent at 3:65-4:2. Based on the generated value, a fault on the electronic circuit may appear as a bright spot, bright line, or bright area at a pixel location corresponding to the location of the fault on the electronic circuit. Id. at 4:16-24, 4:34-38, 5:12-16.
The '982 patent includes 25 claims. SEMICAPS alleges that Hamamatsu infringes at least claims 4-7 and 21-25. Compl. ¶ 13. At the hearing SEMICAPS represented that it also asserts claims 8 and 17. See Mot. 12 n.3; Opp'n 1. Claims 4-8 and claim 17 pertain to a method of testing an electronic circuit, while claims 21-25 describe a related apparatus.
Claims 4-8 depend from independent Claim 1, which states:
Claims 4-8 and claim 17 add the following limitations to Claim 1:
Claim 21 is an independent claim and describes an apparatus:
'982 Patent at 12:19-31. Claims 22-25 depend from claim 21. They recite:
Id. at 12:32-43.
SEMICAPS alleges that Hamamatsu infringes the asserted claims either literally or under the doctrine of equivalents. Compl. ¶ 13. It contends that Hamamatsu infringes the claims "by making, using, selling, offering to sell, and/or importing into the United States Hamamatsu's M10383 Digital Lock-in Kit (‘M10383’) ..., testing equipment incorporating or retrofitted to include the M10383, and other technology that incorporates the infringing aspects of the M10383 ... (the ‘Accused Products’)." Id. ; Compl. Ex. B. According to SEMICAPS, Hamamatsu's PHEMOS and iPHEMOS series of emission microscopes use OBIRCH for semiconductor failure analysis and incorporate the M10383, and "compete with SEMICAPS' Scanning Optical Microscopes." Id. at ¶¶ 14, 15; Compl. Ex. C. In its complaint, SEMICAPS alleges that the Accused Products infringe claims 4-7 and 21-25 of the '982 patent by performing the method specified in the patent and using the apparatus of the asserted claims when conducting OBIRCH analysis. Id. at ¶¶ 20-54.
SEMICAPS filed this lawsuit on June 14, 2017. On September 19, 2017, the court granted Hamamatsu's unopposed motion to stay the case pending inter partes review ("IPR") proceedings initiated by Hamamatsu challenging the validity of the '982 patent. [Docket No. 28.] This case resumed following the issuance of two Final Written Decisions by the Patent Trial and...
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